Layers count

16

24

30

Minimum board thickness (with solder mask)

0.4mm

0.40mm

0.30mm

Maximum board thickness

4mm

6mm

6mm

Minimum board size

30mm x 30mm

30mm x 30mm

30mm x 30mm

Maximum board size

600mm x 570mm

600mm x 570mm

600mm x 570mm

Minimum line/space innerlayer (depend on copper weight)

3mil/3mil

2.5mil/2.5mil

2.5mil/2.5mil

Minimum line/space outerlayer (depend on copper weight)

4mil/4mil

3mil/3mil

2.5mil/2.5mil

Surface finish types

OSP, HASL, ENIG, Immersion Silver, Immersion Tin, Hard gold (Connector board)

Hard gold (Selective board) soft gold, ENEPIG

Plus ISIG,EPIG

Mechanical hole size (Finish hole size)

0.2 mm

0.15 mm

0.15 mm

Maximum aspect ratio PTH

10

12

16

Finished tolerance PTH

+/-0.075 mm

+/-0.05 mm

+/-0.05 mm

Finished tolerance NPTH

+/-0.05 mm

+/-0.05 mm

+/-0.05 mm

Epoxy filled through holes (Y/N)

Y

Y

Y

Capped via (Y/N)

Y

Y

Y

Maximum copper weight outerlayer

6 oz

8 oz

10 oz

Maximum copper weight innerlayer

6oz

6oz

>6oz

Control depth drill (Y/N)

Y

Y

Y

Drill depth tolerance

+/-0.2 mm

+/-0.15 mm

0.10 mm

HDI type

2 + N + 2

3 + N + 3

Anylayer

Min. laser hole diameter

0.1

0.075

0.075

Copper filled microvia

Y

Y

Y

Resin filled microvia

Y

Y

Y

Stacked &Staggered via

Y

Y

Y

Rigid-flex boards layers

16

20

30

Flex boards

Y

Y

Y

IMS boards

Y

Y

Y

Embedded components

N

Y

Y

Soldermask via plugging IPC4761 type VI

Y

Y

Y

Epoxy via plugging IPC4761 type VI

Y

Y

Y