Capacity Of FPC
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| Item | Current Capability |
| Layer Count(Max) | FPC:1~8L ; R-F:1~16L |
| Min. Finished Board Thickness(mm) | FPC:0.05mm ; R-F:0.3mm |
| Max. Finished Board Thicknes(mm) | FPC:0.06mm ; R-F:2.0mm |
| Max.Production Panel Size | 500*500mm |
| Min Core Thickness(mm) | 0.056mm |
| Min Core Dielectric Thickness(mm) | 40um |
| Min. Drilled Hole Size-Mechanical(mm) | 0.15mm |
| Min. Drilled Hole Size-Laser | 0.075mm |
| Max.Drilled Hole Size-Mechanical(mm) | 6.5mm |
| Min.PTH Slot Hole Size(mm) | 0.35mm |
| Min.NPTH Slot Hole Size(mm) | 0.3mm |
| Drilling Hole to Hole Accuracy(mm) | ±0.075mm |
| PTH Tolerance(mm) | ±0.075mm |
| NPTH Tolerance(mm) | ±0.05mm |
| Controlled Depth Drilling Tolerance | ±0.1 |
| Max.Mechanical Drill Aspect Ratio | ≤8:1 |
| Max.Laser Drill Aspect Ratio | ≤0.85:1 |
| PTH to Copper | ±0.075mm |
| Min.Inner Layer Trace | 0.04mm |
| Min.Inner Layer Space | 0.04mm |
| Min.Outer Layer Trace | 0.04mm |
| Min.Outer Layer Space | 0.04mm |
| Trace Width Tolerance | ±0.07mm |
| Max.Inner Layer Copper Thickness | 2OZ |
| Max.Outer Layer Copper Thickness | 4OZ |
| Impedance control Tolerance % | ±7% |
| Layer to Layer Registration Tolerance＜10L | 0.15mm |
| Layer to Layer Registration Tolerance ≥10L | 0.2mm |
| Via In PAD | 0.1mm |
| Min.IC Pad Size | 0.1mm |
| Min.BGA Pad Size | 0.2mm |
| Soldermask Registration | 0.05mm |
| Min.Solder Dam | 0.05mm |
| S/M Registration | 0.038mm |
| Min. Legend Height/Width | 0.5mm/0.4 |
| Routing Outline Tolerance | ±0.075mm |
| Punch Outline Tolerance | ±0.07mm |
| V-cut Location Tolerance | ±0.075mm |
| V-cut Residual Tolerance | ±0.075mm |
| GF Charmfer Angel | 15-45° |
| GF Charmfer Angel Tolerance | ±3° |
| GF Charmfer Depth(mm） | 0-3.0mm |
| GF Charmfer Depth Tolerance | ±0.1mm |
